Infineon has announced a major expansion of its SDV, software-defined systems (SDX) and Physical AI portfolio.

TI has introduced two new industrial communications products aimed at helping manufacturers simplify connectivity.

Qualcomm once occupied an enviable position, but now appears to have entered a more challenging business environment.

MediaTek has reported double-digit growth in both revenue and profit for the third quarter of 2026, while confirming it has ...

Microchip adds EtherCAT and Time-Sensitive Networking (TSN) capabilities to its PolarFire FPGA and SoC platforms.

How cloud-hosted FPGAs are transforming hardware evaluation into an instant, zero-install software experience.

Movandi has introduced a new 60GHz wireless connectivity platform for AI, broadband and network infrastructure.

The IP65 option is available on the larger L and XL versions of the SMART-CASE range, provided the enclosure is specified ...

The AI race is seen as a contest to build the most advanced processors, but could photonics give Europe the edge?

MIKROE has launched the UNI Hall 3 Click board, a compact add-on module designed to support the development of contactless ...

TDK has introduced the TDK-Lambda EDC series of programmable DC-DC power supplies, targeting applications that are ...

Among the new products are wide-body, high-isolation versions of Allegro's ACS37030 and ACS37002 current sensors, the ...