VocalFusion XVF3800 voice processor from XMOS. The device integrates far-field voice processing for up to four digital microphones in a single device, providing acoustic echo cancellation (AEC), ...

Global semiconductor sales climbed to $517.7 billion in Q3 2026, with September sales reaching $172.6 billion as all major ...

The PLC is the brain that runs machines, processes and installations. Ardbox Q adds the ability to analyse what happens with AI in a single device. Industrial Shields, a manufacturer of industrial ...

Next-generation fixed optical gas imaging solution combines continuous monitoring with enhanced detection, analytics, and versatile camera options Teledyne FLIR has introduced new capabilities for its ...

Fly-Wing Technologies will attend electronica 2026 in Munich, highlighting global electronic component sourcing, hard-to-find ...

Renesas Electronics Corporation has launched the RX74M and RX74N, new flagship 32-bit MCUs that deliver up to 600MHz performance and are the first in the RX Family to be built on a 22nm process and ...

TE Connectivity's HC-STAK 35 high-voltage interconnection system is now available from Mouser, offering 400A current handling ...

A2 Global Electronics has achieved AS9100 certification, expanding its quality management framework for component processing, ...

Delivering up to 34 TOPS of total platform AI performance, with support for AI acceleration module expansion; Darveen has launched the DPC-1210 Industrial Panel PC, powered by the ...

TRF2001 multiprotocol RF FEM from Texas Instruments. The device is a high-performance ISM-band multiprotocol and Wi-SUN FEM for low-power wireless applications in the sub-1GHz band. Typical ...

Qt Group has unveiled Clate, a new AI-powered design environment for embedded interfaces, combining no-code development, ...

Anritsu Corporation has developed and launched new RF characteristics evaluation options for the next-generation WLAN standard Wi-Fi 8 (IEEE 802.11bn) and Bluetooth Low Energy (LE) for its Wireless ...