Imec has demonstrated the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a ...
Molex and Neoconix have partnered to deliver a flexible, copper-based high-density and speed (HD&S) interposer. The low-profile contact interface integrates Molex Copper Flex with Neoconix’s HD&S ...
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